Watch 101

DRIE

Deep reactive-ion etching is a fabrication process used to create parts from silicon wafers. Through lithography, a mask is made that determines the outlines of the part shapes on the silicon wafer. The wafer is then plasma etched. DRIE was originally developed for MEMS devices (the accelerometer in your smart phone is one) but recently has begun being used for horological applications due to its precision and the material properties of silicon.

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